The 2019 International Conference on Electronic Engineering and Informatics (EEI 2019) will be held on 8-10 November, 2019 in Nanjing, China. EEI 2019 is to bring together innovative academics and industrial experts in the field of Electronic Engineering and Informatics to a common forum. The primary goal of the conference is to promote research and developmental activities in Electronic Engineering and Informatics and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in Electronic Engineering and Informatics and related areas.
We warmly invite you to participate in EEI 2019 and look forward to seeing you in Nanjing!
All accepted papers of EEI 2019 will be published in the IEEE CS CPS (Conference Publishing Services),
which will be submitted to IEEE Xplore, EI Compendex, Scopus, Inspec, DOAJ, and CPCI (Web of Science)
所有的投稿都必须经过2-3位组委会专家审稿，经过严格的审稿之后，最终所有录用的论文将由 IEEE CS CPS (Conference Publishing Services)出版，见刊后由期刊社提交至 IEEE Xplore, EI Compendex, Scopus, Inspec, DOAJ, and CPCI (Web of Science)检索，目前该期刊EI和CPCI检索非常稳定。
Journal 1 (IF≈1.6): Topics related to physical science applications, theory, performance studies, and experiments.
Journal 2 (IF≈1.6): Research on image and video processing.
Journal 3 (IF≈2.2): Topics related to new materials and technologies in the electronics field.
Journal 4 (IF≈1): Topics related to computer science theories, methods and tools; computer and communication networks and systems; computational intelligence, machine learning and data analysis; security of computer systems and networks.
*Papers must not be less than 10 pages in length and should be submitted to email@example.com, and noted SCI-EEI2019. 额外征集10篇优秀论文发表到SCI期刊，录满即止，欢迎投稿！论文需不少于10页，仅可通过邮箱service@keoaeic.org投稿，且需标注“SCI-EEI2019”，SCI期刊事项联系巫编辑-手机/微信 13922157504
Submission: September 6, 2019 October 25,2019
Notification: About 2 weeks after the submission
Conference: November 8-10, 2019